Iyada oo ay sabab u tahay ballaarinta degdegga ah ee shuruudaha awoodda xisaabinta AI, baahida loo qabo qaboojiyeyaasha yar-yar ee kuleylka (Micro-TECs) ayaa si weyn kor ugu kacday 2026. Maaddaama xarumaha xogta ee AI-ku-wado ay si isa soo taraysa ugu tiirsan yihiin isku-xirka indhaha ee bandwidth-ka sare leh, tobanaan kun oo modules-ka indhaha ah xarun kasta hadda waxay gudbiyaan tiro badan oo xog ah xawaare iftiin u dhow. Kobacani wuxuu asal ahaan salka ku hayaa caqabadaha maaraynta kulaylka ee sii kordhaya ee la xiriira horumarinta cufnaanta xisaabinta - gaar ahaan kaabayaasha AI - halkaas oo xakamaynta heerkulka saxda ah ay noqotay mid aan lagama maarmaan u ah isku hallaynta nidaamka, hufnaanta calaamadda, iyo cimri dhererka qalabka. Caqabadahani waxay ka muuqdaan afar qaybood oo codsi oo muhiim ah:
1. Gudbinta laf-dhabarta ee masaafada dheer: Modules-ka indhaha ee isku-dhafka dhererka cufan (DWDM) - oo awood u leh masaafada gudbinta ee ka badan 80 km - waxay u baahan yihiin Micro-TECs (modules-ka yar ee thermoelectric, modules-ka yar ee peltier) si loo ilaaliyo xasilloonida heerkulka diode-ka laysarka ee dulqaadka adag, taasoo ka hortagaysa qulqulka hirarka iyo hubinta go'doominta kanaalka muuqaalka ee shabakadaha asaasiga ah.
2. Xarumaha xogta ee waxqabadka sare leh: Kooxaha tababarka AI iyo xarumaha xisaabinta daruuraha, wareegyada isku dhafan ee photonic-ga ee isku-dhafan (PICs) waxay soo saaraan qulqulo kuleyl oo maxalli ah oo muhiim ah. Micro-TECs, module-ka qaboojinta ee thermoelectric-ka yar, walxaha micro peltier waxay bixiyaan kuleyl firfircoon, waqti-dhab ah si loo ilaaliyo heerkulka hawlgalka ugu wanaagsan ee xisaabinta iyo isku xirka nidaamyada hoose.
3. Kaabayaasha isgaarsiinta 5G/6G: Saldhigyada saldhigga ee bannaanka waxay ku shaqeeyaan isbeddel heerkul oo aad u daran (tusaale ahaan, −40 °C ilaa +85 °C). Micro-TECs, aaladaha micro peltier, qaboojiyeyaasha micro-peltier waxay awood u siinayaan nidaaminta kulaylka laba geesoodka ah - qaboojinta inta lagu jiro kulaylka ugu sarreeya iyo kuleylka inta lagu jiro xaaladaha ka hooseeya eber - hubinta shaqada module-ka indhaha ee aan kala go 'lahayn dhammaan deegaannada hawlgalka.
4. Nidaamyada isgaarsiinta indhaha ee isku xiran: Shabakadaha fiber-optic ee magaalooyinka waaweyn, kuwa ballaaran, iyo kuwa badda hoosteeda mara, qalabka gudbiyaha ee isku xiran waxay ku soo rogaan shuruudo adag oo xasillooni marxaladeed iyo kala-goyn ah calaamadaha indhaha. Micro-TECs, modules-yada Micro-peltier, qaboojiyeyaasha thermoelectric-ka yar waxay keenaan xasillooni heerkul ah oo heer-millikelvin ah—oo muhiim u ah ilaalinta daacadnimada ogaanshaha isku-dhafan iyo yaraynta heerarka khaladaadka bit-ka (BER).
5. Isgaarsiinta warshadaha iyo kuwa muhiimka ah: Deegaannada adag—oo ay ku jiraan otomaatiga warshadaha, nidaamyada la socodka, iyo codsiyada hawada—Micro-TECs, walxaha yaryar ee peltier waxay hubiyaan waxqabadka module-ka indhaha oo adag oo ku baahsan heerkulka dheeraadka ah (−40 °C ilaa +105 °C), iyagoo taageeraya isku halaynta hawlgalka muddada dheer.
I. Xakamaynta kulaylka saxda ah oo ah sababta ugu weyn ee koritaanka
Modules-ka indhaha ee xawaaraha sare leh—gaar ahaan kuwa ka shaqeeya 800G, 1.6T, iyo heerarka xogta ee soo baxaya ee 3.2T—ayaa aad ugu nugul isbeddellada kulaylka. Diodes-ka laysarka waxay muujiyaan ku tiirsanaan heerkulka gudaha ah, taasoo kicinaysa hoos u dhac ku yimaada waxqabadka:
• Kala-baxa dhererka hirarka: Layser-yada jawaab celinta ee la qaybiyey (DFB), tusaale ahaan, waxay muujiyaan isku-darka hirarka-heerkulka caadiga ah ee ~0.1 nm/°C. Inta u dhaxaysa baaxadda hawlgalka ganacsiga (0–70 °C), tani waxay u tarjumeysaa ilaa 7 nm oo isbeddel muuqaal ah - oo ka sarreeya kala-fogaanshaha kanaalka ee nidaamyada badan ee DWDM waxayna keenaysaa is-weydaarsiga kanaalka iyo kororka BER.
• Xasillooni la'aanta awoodda indhaha: Isbeddellada heerkulka ayaa si toos ah u beddesha heerka qulqulka laysarka iyo hufnaanta jiirada, taasoo keenta kala duwanaanshaha awoodda wax soo saarka iyo saamiga calaamadda-ilaa-sawaxanka oo xumaada (SNR).
• Gabowga qalabka oo la dedejiyay: Hawlgalka dheer ee ka baxsan baqshadda kuleylka ee ugu habboon wuxuu dardar geliyaa hababka burburka - oo ay ku jiraan oksaydhka wejiga iyo kororka cilladaha ceelka quantum - taasoo yaraynaysa waqtiga celceliska ah ee lagu guuldareysto (MTTF).
Marka la eego caqabadahan, modules-ka indhaha ee jiilka xiga ee AI-ku-habboon ayaa waajib ka dhigaya saxnaanta xasilinta heerkulka ±0.05 °C ama ka wanaagsan - shuruudaha oo keliya Micro-TECs, aaladaha peltier-ka yar yar, modules-ka TEC-ga yar yar, modules-ka thermoelectric-ka yar yar ayaa ku qancin kara arrimaha qaabaysan (<3 mm² raad-raaca) iyo waqtiyada jawaab celinta ee ka hooseeya 100 ms. Sidaas darteed, ku dhawaad dhammaan modules-ka dhexe iyo kuwa sare ee 800G+ waxay isku daraan nidaamyada maaraynta kulaylka ee wareegsan oo ka kooban modules-ka Micro-TECs, Micro-TEC, aaladaha peltier-ka yar yar, modules-ka micro TE-ga ee saxda ah, iyo ICs-ka xakamaynta heerkulka ee gaarka ah - si wax ku ool ah u "xiraya" heerkulka isgoyska laser-ka ilaa ±0.02 °C ee setpoint.
Soo jeedinta qiimaha shaqayneed ee Micro-TECs, modules-ka qaboojinta thermoelectric-ka yar yar, curiyayaasha thermoelectric-ka yar yar ee modules-ka indhaha waxay ka kooban yihiin saddex cabbir oo isku xiran:
• Xasiloonida muuqaalka: Xakamaynta firfircoon ee socodka hirarka ayaa hubisa isku-dhafka kanaalka, waxay meesha ka saartaa is-dhaafsiga, waxayna ilaalisaa BER hooseeya marka la eego culaysyada kulaylka firfircoon;
• Hagaajinta daacadnimada calaamadda: Qaboojinta/kuleylka la qabsiga ah waxay magdhab u tahay ku-meel-gaadhka kulaylka ee deegaanka iyo culeyska keena, xasilinta awoodda indhaha iyo hagaajinta qoto-dheeraanta isbeddelka iyo saamiga baabi'inta;
• Kordhinta cimriga: Soo saarista kulaylka oo hufan waxay yareysaa uruurinta cadaadiska kulaylka, dib u dhigista burburka walxaha iyo yaraynta heerarka cilladaha goobta ilaa 40% (xogta tijaabada nolosha ee la dedejiyay).
II. Cabbiraadda baaxadda leh ee Micro-TEC, qaybinta modules-ka yaryar ee server-ka AI kasta
Adeegayaasha tababarka AI ee casriga ah waxay caadi ahaan isku daraan 16-32 modules oo ah kuwa xawaaraha sare leh—mid walba wuxuu u baahan yahay 2-3 Micro-TECs, modules-yada yar yar ee thermoelectric (modules-ka qaboojinta thermoelectric-ka yar) iyadoo ku xiran heerka xogta, qaab-dhismeedka baakadaha (tusaale ahaan, muraayadaha la isku-xidhay, CPO), iyo margin naqshadeynta kulaylka. Sidaas darteed, hal server-ka sare ee AI wuxuu ku dari karaa 40-90 Micro-TECs (walxaha yaryar)—oo matalaya koror 5-10× ah marka loo eego server-yada ganacsiga ee caadiga ah. Iyada oo shixnadaha module-ka indhaha ee 800G/1.6T ee caalamiga ah ee la saadaaliyay inay ka badan yihiin 15 milyan oo unug sannadkii marka la gaaro 2026, wadarta baahida Micro-TEC ee kooxaha AI ee cabbirka petabyte ayaa la filayaa inay gaarto tobanaan milyan oo unug sannadkii.
III. Soo ifbixidda qaboojinta dareeraha isku-dhafan + Qaab-dhismeedka Micro-TEC (modules-ka qaboojinta thermoelectric-ka yar)
Iyadoo dardar-geliyeyaasha jiilka xiga ee AI - oo ay ku jiraan madal GB300 ee NVIDIA - ay riixaan baqshadaha awoodda GPU ee ka baxsan 1,000 W halkii dice, xalalka qaboojinta hawada ayaa gaaray xadka thermodynamic aasaasiga ah ee dejinta raafka cufnaanta sare. Sidaa darteed, qaboojinta dareeraha ah ayaa noqotay heerka dhabta ah ee maaraynta kulaylka heerka raafka iyo chassis. Qaabkan dhexdiisa, istaraatiijiyad qaboojin oo kala sarreyn ah ayaa soo baxday: qaboojinta dareeraha waxay qabataa ka saarista kulaylka badan heerka nidaamka, halka Micro-TECs (qaboojiyeyaasha yaryar ee peltier) ay sameeyaan nidaamin kuleyl oo heer jajab ah oo jilicsan - taasoo awood u siinaysa isku mid ahaanshaha kulaylka aan horay loo arag ee dhammaan diimaha photonic iyo elektiroonigga ah. Qaab-dhismeedkan isku-dhafka ah wuxuu dhigayaa Micro-TECs, modules-ka yar-thermoelectric sidii awood-bixiye muhiim ah - maaha oo keliya qayb kaabayaal ah - ee ku jira xirmooyinka kulaylka AI.
IV. Beddelka gudaha ee la dedejiyay iyadoo ay jiraan xayiraadaha sahayda adduunka oo dhan
Taariikh ahaan, >80% aaladaha Micro-TEC-yada ee saxda ah (Micro TEC modules) waxaa keenay soo saarayaasha Jabbaan. Si kastaba ha ahaatee, baahida sii kordheysa ee la xiriirta AI ayaa kordhisay waqtiyada hogaanka ee alaab-qeybiyeyaasha hadda jira - qaarkood waxay dhaafeen 26 toddobaad - waxayna xaddiday qoondaynta awoodda macaamiisha istaraatiijiga ah. Soo saarayaasha modules-ka TEC ee gudaha Shiinaha ayaa ka faa'iideysanaya qodobkan isbeddelka: dardargelinta wareegyada u-qalmitaanka AEC-Q200 iyo Telcordia GR-468 oo leh iibiyayaasha modules-ka indhaha ee Tier-1, kordhinta awoodda wax-soo-saarka bille ilaa heerarka hal milyan oo unug, iyo gaarista sinnaanta waxqabadka (±0.03 °C xasilloonida, >1.2 W/mm² cufnaanta qaboojinta) iyadoo lala kaashanayo dhiggooda caalamiga ah ee hormuudka ka ah.
Marka la soo koobo, isku-dhafka horumarka cufnaanta xisaabinta AI, kordhinta baaxadda, iyo is-dhexgalka photonics ayaa kor u qaaday Micro-TECs (modules-yada Micro peltier) laga bilaabo qaybaha kuleylka ee durugsan ilaa walxaha kaabayaasha aasaasiga ah. Hadda waxay u adeegaan sidii "baahi aan la arki karin" - go'aamiye aamusan laakiin aan lagama maarmaan ah oo ku saabsan waqtiga shaqada ee xarunta xogta AI, wax-soo-saarka xisaabinta, iyo wadarta guud ee kharashka lahaanshaha muddada-dheer.
Shirkadda Beiing Huimao Cooling Equipment Co., Ltd. oo leh in ka badan soddon sano oo khibrad u leh naqshadeynta iyo soo saarista qaybaha qaboojinta ee yar yar ee Micro-TECS, shirkaddayadu waxay si guul leh u samaysay faylal kala duwan oo xalal qaboojin oo yar yar oo loogu talagalay tilmaamaha macaamiisha caalamiga ah. Alaabooyinkan waxaa si ballaaran loogu qaybiyaa hawada sare, qalabka caafimaadka, isgaarsiinta indhaha, iyo codsiyada warshadaha ee saxda ah. Waxaan soo dhaweyneynaa iskaashiga istaraatiijiyadeed ee lala yeesho la-hawlgalayaasha caalamiga ah si loo wada-shaqeeyo injineernimada iyo horumarinta wadajirka ah ee teknoolojiyada qaboojinta ee jiilka soo socda ee thermoelectric.
Faahfaahinta TES1-00401T200
Heerkulka dhinaca kulul: 50 C,
Imax: 0.8A,
Vmax: 0.48V
Qmax：0.3W
Delta T ugu badnaan：76 C
ACR: 0.5 Ohm
Cabbirka: 2.3 × 1.1 × 0.95mm
Waqtiga boostada: Agoosto-11-2026
